Assembly - Wire Bonder

About the Role

We are scaling tomorrow's world, TODAY! We continue to expand our team, a team shaping the future of our industry and sharing our passion to reveal the invisible! Our Wire Bonders are responsible for precision assembly of optoelectronic components in our cleanroom manufacturing environment. This role supports production operations by performing wire bonding, assembly, inspection, and basic electrical testing of chips/die mounted to ceramic substrates and/or packages such as TO cans and LCCs. The Wire Bonder works as part of a production team reporting to Operations, while collaborating closely with Engineering and Quality to meet product, process, and customer requirements. This full-time, non-exempt role reports to the Director of Operations and is located at our Salem, NH Facility.

Responsibilities

• Assembly & Wire Bonding:
  • Perform manual and semi-automated wire bonding of chips and die to ceramic substrates and packages (e.g., TO can, LCC) using various gauges of wire.
  • Prep material, set up, and operate wire bond equipment per approved work instructions and travelers.
  • Handle optoelectronic devices using proper ESD, cleanliness, and contamination (FOD) control techniques.
  • Support engineering builds, process development, and continuous improvement activities, as needed.
• Inspection, Testing & Quality:
  • Conduct visual inspection of assemblies under a microscope to applicable MIL STD883 workmanship criteria.
  • Perform basic electrical “go/no go” and at times more advanced testing using standard test fixtures and equipment.
  • Identify, document, and report nonconforming material or process issues.
  • Maintain accurate production records, travelers, and inspection results using our ERP system and shop floor interface.
• Handling, Packaging & Workflow:
  • Package finished assemblies per work instructions and cleanliness requirements.
  • Maintain material traceability and proper part identification throughout the process.
  • Follow cleanroom protocols, including gowning, tool control, and housekeeping standards.
  • Work effectively within a team environment to meet production schedules and quality goals.

Qualifications & Skills

• High School / GED or Technical trade school.
• 2-3 years’ experience in a manufacturing or technical environment.
• Prior experience in microelectronics or optoelectronic assembly preferred (wire bonding experience highly desired).
• Ability to work under a microscope and handle small, delicate components.
• Familiarity with ESD controls, cleanroom practices, and regulated manufacturing environments.
• Strong attention to detail, good manual dexterity, and ability to follow detailed instructions.

Physical Requirements

This position may require sitting for long periods at a microscope, bending, reaching, visual acuity for inspection, and lifting up to 30 lbs. These activities are performed in a cleanroom environment that is temperature and humidity controlled. This position requires wearing complete fab attire for an entire shift and meeting all safety and cleanroom requirements, including:

• Hand Hygiene
• Personal Item Removal
• Gowning Area Preparation
• Order of Gowning
• Shoe Covers
• Hair Covers
• Face Masks
• Coveralls/Gowns
• Gloves
• Additional Garments
• Final Inspection
• Maintaining proper protocols.

About GPD

At GPD Optoelectronics, we believe that by operating with integrity and trust, we drive constant organizational improvement, which strengthens our relationships with our employees and customers. Customer success remains our highest priority, so we strive to deliver high-quality products on time and provide unparalleled service, responsiveness, and collaboration. Founded in 1973 as Germanium Power Devices Corp, we began by making high-quality germanium transistors. Since the early 1980s, we have earned our place as a trusted manufacturer of both germanium and indium gallium arsenide photodiodes. We are located in Salem, NH.