AI Research Engineer/Scientist

About the role

The Corporate Technology Office Team at Intel is dedicated to advancing datacenter connectivity and enhancing Intel's competitive edge in scalable AI system design. This role involves developing electro-optical architecture for research and development purposes, collaborating with cross-functional teams, and leading overall project development.

Responsibilities

• Define architectures and designs that meet specifications and performance targets for next-generation optical interconnects.
• Optimize core integrated circuit electro-optical components.
• Collaborate with cross-functional teams to lead overall project development.
• Develop simulation methodologies for scalable electro-photonic systems.
• Design digital and mixed-signal accelerators for state-of-the-art algorithms.
• Advise on the development of test plans for post-silicon characterization.
• Thoroughly document all design work with review materials and detailed design descriptions.

Qualifications

• Ph.D. in Electrical and Computer Engineering, Optics and Optical Engineering.
• Track record of peer-reviewed publications and/or patents in the simulation, design, optimization and implementation of heterogeneously integrated electro-optical devices, as well as Electronic-Photonic ICs.
• At least 3 years of experience in digital and mixed-signal design flows with proven track record of successful tapeouts.

Preferred Qualifications

• Strong proficiency with electronic and photonic integrated circuit (EIC and PIC) design CAD tools.
• Extensive design experience using hardware description languages (Verilog, Verilog-A) and high-level programming languages (C/C++, python).
• Deep expertise in the design and optimization of active and passive optoelectronic modulators.
• Knowledgeable in 2.5D/3D packaging and integration techniques.
• Familiarity with switch fabric architectures and related routing algorithms.
• Hands-on experience in laboratory testing and characterization of integrated circuits.
• Solid understanding of high-speed analog circuitry, including transimpedance amplifiers (TIAs) and modulator drivers.
• Proven experience of building end-to-end simulation frameworks bridging electronics, photonics and packaging.