Advanced R&D Engineer/Scientist

About the role

As an R&D Engineer/Scientist at Solstice, you will play a critical role in developing next-generation materials and solutions that enable advanced semiconductor packaging and high-performance computing applications. You will lead the design, development, characterization, and commercialization of innovative advanced semiconductor packaging technologies, partnering closely with customers, cross-functional teams, and external partners to solve complex heat management challenges. You will report directly to the Senior Manager R&D (Applications Development) and work closely with customers, marketing, manufacturing, technical services, and product development organizations. In this role, you will serve as both a technical expert and strategic partner, translating market needs into scalable product solutions that create value for customers and drive growth for Solstice.

Responsibilities

• Lead the development and commercialization of materials and technologies for advanced semiconductor packaging from concept through scale-up and commercial launch.
• Partner directly with customers to understand technical challenges, provide applications support, and identify opportunities for new product development.
• Generate applications data through simulation, modeling, and experimental testing to solve chip-level and package-level thermal management challenges.
• Collaborate with cross-functional teams including R&D, manufacturing, quality, marketing, and technical services to transition new technologies into commercial production.
• Establish material specifications and qualification requirements to support manufacturing readiness and customer adoption.
• Apply statistical analysis, Design of Experiments (DOE), and engineering methodologies to optimize product performance and process capability.
• Partner with external suppliers, research organizations, and industry partners to support technology development and roadmap alignment.
• Communicate technical findings, business recommendations, and strategic opportunities to senior leadership, customers, and external stakeholders.

Requirements

• Master’s degree (Ph.D. preferred) in Material Science, Chemical Engineering, Polymer Science, or Chemistry
• 3+ years of hands-on industry or research experience in packaging module development involving innovative assembly materials—such as underfills, molding compounds, adhesives, and substrates—to enable next-generation semiconductor technologies like 2.5D/3D integration.
• Proven experience in customer engagement by bridging R&D with customer needs, by being a technical liaison to the market across a broad range of products and technologies.

Skills

• Technical expertise: deep knowledge of advanced packaging architectures like flip-chip, 2.5D/3D stacking, wafer-level packaging, and heterogeneous integration.
• Good understanding how foundries (factories that build wafers) and OSATs (Outsourced Semiconductor Assembly and Test facilities) build and test packages.
• Strong knowledge of structure-property-performance correlations in polymers/metals and familiarity with failure analysis tools (SEM, X-Ray, CSAM).
• Customer Interface: Act as the technical expert to help clients optimize polymers, adhesives, and metals