Advanced Packaging Metrology Engineering Manager

About the role

Intel Corporation is a global technology leader at the forefront of semiconductor innovation, dedicated to creating world-changing technology that improves the lives of every person on the planet. Intel's Wafer-Level Assembly Technology Development (WATD) group is a dynamic, forward-thinking organization focused on developing next-generation packaging technologies. With a culture built on collaboration, inclusion, and relentless innovation, Intel offers an environment where your work truly matters — and where the future of technology is being written every day. We are seeking a visionary and technically accomplished Advanced Packaging Metrology Engineering Manager to lead a high-performing team of engineers at the cutting edge of advanced semiconductor packaging. In this pivotal role, you will drive innovation in wafer-level assembly technologies, champion manufacturing readiness, and deliver results that reinforce Intel's position as a global technology leader. You will shape the future of advanced packaging by enabling robust process pathways, executing long-term technology strategies, and cultivating a team culture rooted in excellence, accountability, and collaboration. Primary location: Hillsboro, Oregon (US).

Responsibilities

• Lead and inspire a team of engineers to develop advanced wafer processing and packaging solutions that push the boundaries of semiconductor technology.
• Drive technology enablement, feasibility studies, and module improvement initiatives that align with Intel's strategic roadmap.
• Ensure successful demonstrations of manufacturing capabilities at high volumes and manage seamless technology transfers to global manufacturing sites.
• Partner with cross-functional teams — including integration, device, and yield engineering — to deliver process solutions that meet device specifications while optimizing safety, quality, and cost.
• Collaborate with supplier executive management to identify and implement innovative concepts into manufacturing processes.
• Execute long-term strategies for module engineering to support future technology needs and market demands.
• Set clear, measurable team objectives and apply differentiated performance management to consistently drive results.
• Coach, mentor, and develop engineers in skills growth, technology road mapping, and pathfinding for future innovations.
• Foster a collaborative, inclusive, and psychologically safe team environment that encourages bold thinking and accountability.

Qualifications

• Minimum Qualifications
  • Bachelor’s degree in science, engineering, or a related STEM field with 6+ years of relevant experience; OR Master's degree in a related STEM field with 4+ years of relevant experience; OR PhD in a related STEM field with 4+ years of relevant experience.
  • Relevant experience can be any of the following:
    • Semiconductor wafer or assembly process, equipment, or materials development.