Advanced Manufacturing RF Product Engineer

About the role

As an Advanced Producibility Engineer you will drive New Product Introduction (NPI) from RF MMIC design concept through high‑volume production. You will combine deep RF circuit design expertise with strong productization experience to deliver high‑performance, manufacturable solutions for advanced Defense Electronics applications. The position co‑develops innovative GaN and GaAs MMIC technologies supporting ground‑ and airborne‑based radars, electronic warfare, and space systems, spanning frequency ranges from L‑band through above Ka‑band. You will report to the Engineering Manager and work on‑site in Richardson, TX.

Responsibilities

• Collaborate with design teams to ensure MMIC designs meet manufacturability (DFM) and testability (DFT) requirements, supporting modeling, simulation, and design improvements.
• Develop and execute wafer‑level and packaged test plans, including RF/microwave characterization (S‑parameters, power, noise figure) and acceptance testing.
• Design, validate, and optimize test fixtures, probe cards, IC packages, and evaluation PCBs for pre‑production and characterization.
• Perform lab‑based device testing and data analysis to define specifications, identify performance gaps, and assess yield risks.
• Support process development, qualification, and fabrication optimization for MMIC technologies (GaAs, GaN, InP) prior to volume production.
• Conduct model validation through measurement‑to‑simulation correlation and refine device model kits.
• Generate test procedures, qualification plans, datasheets, and technical reports; support customer applications and engineering documentation.
• Assist in prototype builds, reliability testing, failure analysis, and production activities including assembly, inspection, troubleshooting, and product delivery.
• Assist in tape‑out and foundry engagement, preparing MMIC designs (GaAs, GaN, SiGe, CMOS) for fabrication, ensuring PDK compliance and seamless coordination through mask release.
• Develop and execute DFM/DFT strategies, characterization plans, and qualification activities (reliability, ESD, thermal, process variation) to ensure production readiness.
• Maintain robust parts and materials processing guidelines, ensuring compliance with quality, traceability, and reliability requirements.
• Work hands‑on in the lab using PNA‑X and RF measurement equipment to support design introduction, validation, debug, and correlation between simulation, wafer probe, and final test data.
• Implement and monitor Statistical Process Control (SPC) methods to track key performance metrics, identify process variation, and drive data‑driven yield improvements.
• Conduct yield analysis, root‑cause investigation, and continuous improvement to resolve early production issues and ensure manufacturing compliance.
• Collaborate across cross‑functional teams and external partners, support IR&D and customer activities, and deliver complete technical documentation throughout the product lifecycle.

Qualifications

• Bachelor’s degree in a technical discipline (e.g., science, technology, engineering, mathematics).
• Minimum 3 years of NPI stage‑gate experience.
• Six Sigma Black Belt certification.
• Minimum 2 years of experience in manufacturing or a high‑tech electronics industry.
• Minimum 2 years of experience using SPC tools such as Minitab, JMP, and Microsoft Office Suite (including SharePoint and Excel).
• Proficiency interpreting schematics, technical drawings, and applying core electronics and microwave theory to manufacturability concepts.
• Ability to obtain and maintain a security clearance.
• Preferred: Bachelor of Science in Electrical Engineering (BSEE).
• Proficiency with CAD software (AutoCAD, SolidWorks, etc.).
• Experience with DoD/military qualification and testing standards.
• Understanding of semiconductor fabrication processes and variability.
• Experience working with foundries on PDK usage, process corners, and statistical analysis.
• Familiarity with yield analysis, test limits definition, and guard‑banding.
• Exposure to high‑volume manufacturing and product cost optimization.
• Strong collaboration skills; ability to work cross‑functionally and independently with accountability.
• Adaptability, problem‑solving mindset, continuous‑improvement focus, and strong organizational/time‑management abilities.
• Excellent written, verbal, and presentation communication skills.
• Strong analytical skills, attention to detail, and critical thinking.

U.S. Person Requirement

Due to compliance with U.S. export control laws and regulations, the candidate must be a U.S. person (U.S. citizen, U.S. permanent resident, or have protected status in the U.S. under asylum or refugee status).

Benefits

• Employer‑subsidized medical, dental, vision, and life insurance.
• Short‑term and long‑term disability coverage.
• 401(k) match, flexible spending accounts, and health savings accounts.
• Employee assistance program and educational assistance.
• Parental leave and 12 paid holidays.
• Paid time off for vacation, personal, and sick time.
• Performance‑driven salary with comprehensive benefits package.

About Honeywell Aerospace

Honeywell Aerospace (NASDAQ: HONA) is an independent, publicly traded aerospace and defense company with a legacy of operational excellence and mission‑focused execution. Our systems are on board 90 % of the world’s aircraft, enabling pilots to navigate with confidence, aircraft to operate more efficiently, and operators to stay ahead of change. We are focused on innovation, customer success, and a culture of accountability and performance as we shape the future of aviation.