Advanced Lead – SiC/GaN Power Module Packaging Engineer

Role & Responsibilities

• Collaborate with power module design team, provide insight on the developed module performance using simulation tools.
• Collaborate with design and R&D teams to ensure manufacturability and scalability of new GaN and SiC power module designs.
• Develop and optimize manufacturing processes for GaN and SiC power modules, including die attach, wire bonding, encapsulation, and testing.
• Identify and implement process improvements to enhance yield, efficiency, and reliability of GaN and SiC power module production.
• Utilize statistical process control (SPC) and other quality tools to monitor and improve process performance.
• Develop and implement quality control procedures to ensure compliance with industry standards and customer requirements.
• Conduct root cause analysis and implement corrective actions to address process-related quality issues.
• Guide the team to maintain detailed process documentation, including process flow diagrams, work instructions, and standard operating procedures (SOPs).
• Prepare technical reports and presentations to communicate process development and improvement activities.
• Train production staff on new processes and equipment.
• Provide technical support to production teams to resolve process-related issues.
• Ensure all manufacturing processes comply with safety regulations and company policies.
• Participate in regular safety audits and risk assessments to identify and mitigate potential hazards.

Qualifications

• Master’s degree or higher in Electrical Engineering, Materials Science, Chemical Engineering, or a related field.
• Minimum of 3 years of experience in semiconductor manufacturing with a focus on power module packaging.
• Additional qualifications include:
• PhD degree in Electrical Engineering, Mechanical Engineering, Materials Science, Chemical Engineering, or a related field.
• Experience with GaN and SiC power module manufacturing and packaging technologies.
• Familiarity with industry standards and regulations related to power electronics.
• Strong knowledge of semiconductor fabrication processes, materials, and equipment.
• Excellent problem-solving and analytical skills.
• Strong communication and interpersonal skills.
• Able to work collaboratively in a cross-functional team environment.

Benefits

• Medical, dental, and vision insurance that begins on the first day of employment.
• Permissive time off policy for newly hired employees.
• Grossly generous 401(k) plan.
• Tuition Reimbursement.
• Life insurance and disability coverage.
• Paid parental leave.
• Disability insurance.
• Life insurance.
• Paid time-off for vacation or illness.